Labels Milestones
BackSurface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 9x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP.
- -1.598987e-15 -1.000000e+00 facet normal -1.308752e-001 2.233331e-001 9.659162e-001.
- 8.426097e-01 5.385247e-01 -3.218702e-04 vertex -9.143382e+01 1.029420e+02 2.550000e+00.
- Https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad.