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Http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias in pads, 6 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-06P-1.25DSA, 6 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0694-9-81&productname=DF12C(3.0)-50DS-0.5V(81)&series=DF12&documenttype=2DDrawing⟨=en&documentid=0000994748), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P; No exposed pad 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic DFN (5mm x 5mm); (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-32/CP_32_27.pdf LFCSP, 48 Pin (JEDEC MO-153 Var AB https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-26S-0.5SH, 26 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 44 Pin, dual row male, vertical entry, PN:G125-FVX2605L0X Harwin Gecko Connector, 20 pins, single row style1 pin1 left Surface mounted socket strip SMD 1x19 2.54mm single row style2 pin1 right Through hole socket strip THT 2x02 1.27mm double row Through hole pin header THT 1x31 2.54mm single row (from Kicad 4.0.7!), script generated Through hole socket strip SMD 1x26 2.00mm single row style2 pin1 right Through hole angled pin header, 1x29, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled socket strip, 2x03, 1.27mm pitch, 4.0mm pin length, double rows Through hole straight Samtec HPM power header series 3.81mm post length, 1x11, 5.08mm pitch, single row style2 pin1 right Through hole angled pin header, 2x17, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x15, 2.00mm pitch, double rows Through hole straight pin header, 2x26, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x40 1.27mm double row surface-mounted straight socket strip, 1x17, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Surface mounted socket strip THT 2x39 2.54mm double row surface-mounted straight socket strip, 1x31, 2.54mm pitch, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled.

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