Labels Milestones
BackFB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 482, 4.2x3.95mm, 90 Ball.
- Normal 6.615330e-01 -7.499159e-01 3.287206e-04 vertex -1.022904e+02.
- Cra04p.pdf Chip Resistor Array, Wave soldering, Vishay CRA06P.
- HLE-122-02-xx-DV-TE, 22 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf.
- 1.178221e-001 facet normal 0.695767.