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BackHttp://www.kicad-pcb.org/ # Format documentation: https://kicad.org/help/file-formats/ # Netlist files (exported from Pcbnew) *.dsn *.ses New KiCad version; non Al panel Gerbers ) ) New KiCad version; non Al panel Gerbers ) ) ) Final revision; added custom DRC as project file tstamp 62e17d71-a82e-47f7-8a14-a0885fbe0008) Final revision; added custom DRC as project file tstamp 885d8854-95c7-40d1-bee9-0e598504ab1c) Final revision; added custom DRC as project file afea9d5a2cf23e2a33a2927086270d4d602f5a2b 46614f2341 Go to file From 1e09530d973ad09b2f481221728128715527464a Mon Sep 17 00:00:00 2001 Subject: [PATCH] Delete '3D Printing/AD&D 1e spell names in Filmoscope setup Add ground fills, fix some clearance issues, make all power traces large 8576ad9482 Added input resistor for sync; placed everything on PCB Added input resistor for sync; placed everything on PCB with exploratory 8hp layout 2x Sockets, all three pins need wires: - clk in - glide in (sleeve and normal both GND 6x Sockets, 2pin: - Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below Clock rate (B100k) (not sure yet which 2 pins LED, Round, FlatTop, Rectangular size 3.0x2.0mm^2, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-13GD(Ver.11B).pdf LED Round FlatTop Rectangular size 5.0x5.0mm^2 2 pins diameter 3.0mm z-position of LED center 1.6mm 2 pins LED_Rectangular Rectangular Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm, 3 pins, pitch 5mm, size 35x7.6mm^2, drill diamater 1.3mm, pad diameter 2.2mm, see http://www.mouser.com/ds/2/324/ItemDetail_1725656-920552.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix MKDS-1,5-10, 10 pins, pitch 10mm, size 15.8x8.2mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00003, 4 pins, pitch.
- Off-center ball grid, ST die.
- Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf.