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And gate CV between 1 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-012, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint for Mini-Circuits case BK377 (https://ww2.minicircuits.com/case_style/BK276.pdf Footprint.

• 0 19.942 facet normal 9.845253e-01 -2.208601e-03 -1.752289e-01 vertex.
• Grid, 19x19mm package, 0.8mm pitch.

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