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Segment SA39-11 SC39-11 SA39-12 SC39-12 Ferrite, vertical, LairdTech 28C0236-0JW-10, https://assets.lairdtech.com/home/brandworld/files/28C0236-0JW-10.pdf, JW Miller core https://www.bourns.com/products/magnetic-products/j.w.-miller-through-hole-ferrite-beads-emi-filters Ferrite vertical LairdTech 28C0236-0JW-10 Circular Fiducial, 1.5mm bare copper, 2.25mm soldermask opening (Level C Circular Fiducial, 0.5mm bare copper, 1.5mm soldermask opening (Level B Circular Fiducial, 0.75mm bare copper, 2mm soldermask opening Circular Fiducial, 0.75mm bare copper, 2mm soldermask opening Circular Fiducial, 1mm bare copper, 1.5mm soldermask opening Circular Fiducial, 0.5mm bare copper, 2.25mm soldermask opening (recommended 5-pin SAW filter package based on SIP7, http://power.murata.com/data/power/ncl/kdc_nma.pdf Isolated 1W single output POE DCDC-Converter, 60W POE, Silvertel, pitch 2.54mm, size 30.94x6.5mm^2, drill diamater 1.3mm, pad diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type175_RT02704HBLC pitch 7.5mm Varistor, diameter 21.5mm, width 6.3mm, pitch 7.5mm Varistor, diameter 21.5mm, width 11.4mm, pitch 10mm size 45x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00046 pitch 5mm size 242x14mm^2 drill 1.15mm pad 3mm Terminal Block WAGO 236-436, 45Degree (cable under 45degree), 24 pins, pitch 3.5mm, size source Multi-Contact FLEXI-xV 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, DF52-9S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, old mpn/engineering number: 5566-08A, example for new part number: A-41792-0015 example for new mpn: 39-28-916x, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=270, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4.

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