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Ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 464, 2.58x3.07mm.

0.0974418 0.108212 facet normal 0.741889 0.638745 0.203973.
"pcb_color": "rgba(0, 0, 0, 0.000)", "schematic_color": "rgba(0, 0.
Top), 7 pins, pitch 9.52mm, size 28.6x12.5mm^2.
Normal -0.466998 0.311849 -0.827443 vertex.

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