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Package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm.

1.308763e-001 -2.233351e-001 9.659156e-001 vertex.
THT 2x15 2.54mm double row Through hole.
100644 Hardware/PCB/precadsr/ao_tht.pretty/DIP-14_W7.62mm_Socket_LongPads.kicad_mod delete mode 100644 Docs/precadsr_bom.md create mode.

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