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Below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CN (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 64-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049CH.pdf SC-74, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf#page=15), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/ADXL363.pdf#page=44 MS5837 Ultra-small gel-filled pressure sensor with stainless steel cap Egg with 42x60mm Body-Size, ClassA, according to land-pattern PL-005, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf Mini-circuits VCXO JTOS PL-005 Footprint for Mini-Circuits cas HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf) following land pattern PL-035, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case TT1224 (https://ww2.minicircuits.com/case_style/TT1224.pdf) following land-pattern PL-258, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for Mini-Circuits case CD636 (https://ww2.minicircuits.com/case_style/CD636.pdf) following land pattern drawing: https://ww2.minicircuits.com/pcb/98-pl225.pdf Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl005.pdf Mini-circuits VCXO JTOS PL-005 Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-176, including GND vias (https://ww2.minicircuits.com/pcb/98-pl236.pdf Footprint for Mini-Circuits case GP731 (https://ww2.minicircuits.com/case_style/GP731.pdf Footprint for Mini-Circuits case HZ1198 (https://ww2.minicircuits.com/case_style/HZ1198.pdf Footprint for mini circuit case CD542, Land pattern PL-094, pads 5 and 6); middle of slider panel (between steps 5 and 6); middle of slider panel (between steps 5 and 6); middle of panel.

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