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FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip, 1x18, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled socket strip, 2x11, 1.00mm pitch, double rows Surface mounted socket strip SMD 1x08 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x24 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x28 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x36 1.27mm double row Through hole straight pin header, 2x11, 2.54mm pitch, single row Through hole angled pin header SMD 2x25 1.00mm double row Through hole angled socket strip SMD 1x12 1.27mm single row Through hole angled socket strip, 2x31, 2.00mm pitch, single row Surface mounted pin header THT 2x31 1.27mm double row surface-mounted straight pin header, 2x23.

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