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BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 1x35, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 2x33, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x03 2.00mm double row Through hole socket strip THT 2x12 1.27mm double row Through hole straight socket strip, 2x38, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x34, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled pin header THT 2x32 1.27mm double row Through hole vertical IDC header THT 2x13 2.00mm double row Through hole angled pin header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight Samtec HPM power header series 3.81mm post length, 1x18, 5.08mm pitch, single row Through hole angled pin header, 2x17, 2.54mm pitch, single row Through hole angled pin header, 1x07, 2.00mm.

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