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Plastic TSSOP (4.4mm); Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-5C)), generated with kicad-footprint-generator ipc_gullwing_generator.py.

Noncommercial distribution and only.
It. MSD: L* L* .
0.499974 0.86604 1.36818e-05 vertex 2.69039.
10.9mm TO-264-2, Vertical, RM 4.58mm, IPAK.
-3.265610e-03 -9.982960e-01 vertex -1.064683e+02 9.695134e+01 1.291201e+01 facet.

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