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Http://www.assmann-wsw.com/fileadmin/datasheets/ASS_0981_CO.pdf PLCC, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152), generated with kicad-footprint-generator JST GH series connector, BM14B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [TSSOP] with exposed pad 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (3mm x 3mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3 https://www.youtube.com/watch?v=xSXH0wFprbY is similar to JEDEC MO-293B Var UAAD (but not the same) , https://www.ti.com/lit/pdf/mpds159f Potentiometer, vertical, shaft hole, Piher PT-10-V10, http://www.piher-nacesa.com/pdf/12-PT10v03.pdf Potentiometer vertical hole Piher PT-15-V02 Potentiometer, vertical, Bourns 3386P, https://www.bourns.com/pdfs/3386.pdf Potentiometer vertical Vishay T73YP Abracon RHCP ceramic patch antenna 854-882Mhz, 5dBi Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, -0.5dBi, https://www.johansontechnology.com/datasheets/2450AT18A100/2450AT18A100.pdf Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, 1dBi, https://www.johansontechnology.com/datasheets/2450AT43F0100/2450AT43F0100.pdf Pulse RF Antenna, 4mm Clearance 6-pin 1.6x0.8 mm balun footprint Johanson 0900PC15J0013 DFN, 10 Pin (http://www.ti.com/lit/ds/symlink/tps7a91.pdf#page=30), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B18B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 2.5, Wuerth electronics 9774040943 (https://katalog.we-online.de/em/datasheet/9774040943.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-4001, 40 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py VQFP, 176 Pin (https://www.onsemi.com/pub/Collateral/566DB.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-147-02-xxx-DV, 47 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2021, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AB), generated with kicad-footprint-generator Harting har-flexicon.

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