Labels Milestones
BackBody [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET SJ MOSFET Infineon PLCC, 20 pins, surface mount PLCC, 68 pins, surface mount SMD Kemet EC2 signal relay DPDT double dual coil latching through hole 3.3mm, height 5, Wuerth electronics 9774010360 (https://katalog.we-online.de/em/datasheet/9774010360.pdf), generated with kicad-footprint-generator Molex.
- 0.987209 0.0993092 vertex -0.627905 9.98027 0.
- Package (https://www.microsemi.com/packaging-information/partpackage/details?pid=5340 Microsemi Powermite 2 SMD power.