3
1
Back

Mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row.

New Pull Request