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53048-0410, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100132.PDF), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-130-02-xxx-DV-BE-LC, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xx-DV-TE, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1410, with PCB locator, 10 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-2210, 22 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-120-02-xxx-DV-BE, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, external M3, height 2.6, Wuerth electronics 9774030982 (https://katalog.we-online.de/em/datasheet/9774030982.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 5.25mm 206mil JPin SMD 5x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 2x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 15.24.

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