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12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x30, 2.54mm pitch, 6mm pin length, double rows Surface mounted pin header THT 2x22 1.27mm double row surface-mounted straight pin header, 1x20, 2.54mm pitch, 8.51mm socket length, double rows Through hole IDC header, 2x32, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x36 2.54mm single row Through hole pin header THT 1x02 1.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Surface mounted pin header THT 1x06 2.54mm single row Through hole angled pin header, 2x07, 1.27mm pitch, double rows Through hole pin header THT 2x14 2.00mm double row Through hole straight pin header, 1x28, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header THT 2x26 1.27mm double row Through hole pin header THT 1x19 2.00mm single row.

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