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Of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x34, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole socket strip SMD 1x10 2.00mm single row style2 pin1 right Through hole angled pin header, 1x39, 2.00mm pitch, 6.35mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x38, 2.54mm pitch, single row Surface mounted socket strip SMD 1x27 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x15, 2.54mm.

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