Labels Milestones
BackSpacing 22.86 mm (900 mils), Socket 12-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket.
- Size 45x12.6mm^2 drill 1.3mm pad 2.6mm Terminal Block.
- Diameter*width=5*2.5mm^2, Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf C.