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- Determine appropriate stand-off hardware for connecting front panel b77534e3fc83cf3f21d8c938a2ebb93ca539acd3 updated README.md updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf TDFN, 6 Pin (https://www.ti.com/lit/ds/symlink/sn74auc1g04.pdf#page=24), Solder Mask Defined VSON, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf), generated with kicad-footprint-generator connector wire 1.5sqmm strain-relief Soldered wire connection with double feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-BE-LC, 19 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x38 2.54mm double row Through hole IDC header, 2x05, 2.54mm pitch, 6mm pin length, single row Surface mounted pin header SMD 2x01 2.00mm double row surface-mounted straight pin header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip THT 2x23 2.00mm double row surface-mounted straight socket strip, 1x36, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x38 2.00mm double row Through hole angled pin header, 2x28, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x12 1.27mm double row Through hole socket strip THT 1x14 1.27mm single row Surface mounted socket strip SMD 1x36 1.27mm single row style2 pin1 right Through hole angled pin header THT 2x37 2.54mm double row Through hole angled pin header THT 2x24 1.27mm double row.

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