Labels Milestones
BackRow spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil 4-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 20-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID.
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