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(mirror false) (drillshape 1) (scaleselection 1) New KiCad version; non Al panel Gerbers # Exported BOM files *.xml *.csv # KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ Initial version *.bck New KiCad version; non Al panel Gerbers From 5a4e89eea63bf71c8fd68e1168f096dfb3459aa4 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Extend trigger mod block to include diode README correction and edits README.md file again README.md | 12 delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIN5.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/D_DO-35_SOD27_P7.62mm_Horizontal.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/TerminalBlock_Degson_DG301_1x03_P5.00mm_Vertical.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Rotary_Switch.kicad_mod delete mode 100644 Hardware/Panel/precadsr_panel.png create mode 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-job.gbrjob create mode 100644 Synth Mages Power Word Stun.kicad_prl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD901F-40-00D_Single_Vertical_CircularHoles.kicad_mod create mode 100644 Panels/dual_vca.scad FN = 100; // [1:1:360] HP = 5.07; // 5.07 for a single 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5020, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3 https://www.youtube.com/watch?v=xSXH0wFprbY is similar to JEDEC MO-293B.

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