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BackLowProfile 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 5.08 mm (200 mils), body size 10.8x11.72mm 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 10x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil reed relay Standex-Meder SIL-relais, UMS, see http://cdn-reichelt.de/documents/datenblatt/C300/UMS05_1A80_75L_DB.pdf Resistor SMD 1218 (3246 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (JEDEC MO-153 Var BC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py Broadcom LGA, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 (so is open.
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