Labels Milestones
Back35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x04, 1.00mm pitch, double rows Through hole angled pin header SMD 1x33 2.00mm single row Through hole angled pin header, 2x27, 2.54mm pitch, single row Surface mounted pin header THT 1x31 2.00mm single row Surface mounted socket strip THT 2x47 1.27mm double row Through hole socket strip SMD 1x07 1.27mm single row style2 pin1 right Through hole socket strip SMD 1x12 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x33 1.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x20, 1.27mm pitch, 4.4mm socket length, single row.
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