Labels Milestones
Back0.5 YZP Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA.
- 50 top-side contacts, 1.0mm pitch, 1.0mm height, SMT.
- 0.08206 0.0817216 0.993271 facet normal -0.22241 0.884711 0.409659.
- Translation_of_cylinder_indentations = [0,8,-8]; cylinder_starting_rotation = -33.3; // these.
- 1812 (4532 Metric), square (rectangular.
- -1.0528 -7.12884 7.81019 facet.