Labels Milestones
Back2x20, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x32 2.00mm single row style1 pin1 left Surface mounted pin header SMD 2x23 1.27mm double row Through hole straight pin header, 1x33, 1.00mm pitch, single row Surface mounted socket strip SMD 2x33 1.27mm double row Through hole pin header THT 2x09 2.54mm double row Through hole straight socket strip, 2x08, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x29, 2.54mm pitch, double rows Through hole pin header THT 2x27 2.00mm double row surface-mounted straight socket strip, 1x01, 2.00mm pitch, 4.2mm pin length, single row Through hole straight socket strip, 1x22, 1.00mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole socket strip THT 1x30 1.27mm single row Through hole angled pin header SMD 1x18 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x23 1.27mm single row Surface mounted socket strip SMD 1x07 1.27mm single row style2 pin1 right Through hole angled socket strip THT 2x25 2.00mm double row surface-mounted straight socket strip, 1x12, 2.54mm pitch, double rows Through hole angled socket strip, 2x02, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header SMD 1x14 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x01 2.00mm double row surface-mounted straight pin header, 2x09, 1.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x40 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x46, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm.
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