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Back*~ .gitignore-extra *.dsn *.kicad_pcb-bak *.kicad_sch-bak *-backups *.kicad_prl *.sch-bak *~ _autosave-* *.tmp *-save.pro *-save.kicad_pcb fp-info-cache # Netlist files (exported from Eeschema *.csv *.lck ########################## # Additional ignored # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 .../Panels/FIREBALL VCO.png | Bin 0 -> 2441420 bytes Synth_Manuals/LABOR_MANUAL.pdf | Bin QuentinEF.ttf => Panels/QuentinEF.ttf | Bin 11930 -> 0 bytes From 811ef45c764021f623b8bb59234df1314fce4e91 Mon Sep 17 00:00:00 2001 Subject: [PATCH] More repo cleanup, adopt github .gitignore file .gitattributes | 2 | 1N5817 | Schottky diode | | | | | | J3 | 1 | 1uF | Film capacitor | | | | | | R30 | 1 | 2_pin_Molex_connector | KK254 Molex connector | | R9, R11, R13 | 3 | 10uF | Polarized capacitor | | R1, R10, R11 | 3 | 1 | LM358 | Low-Power, Dual Operational Amplifiers, DIP-14/SOIC-14"/>
- 2.387000e-07 facet normal -0.0221424 0.0970097 -0.995037 facet normal.
- 4.866831e-001 -8.343583e-001 2.588163e-001 facet normal 7.480908e-001.
- Grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD.
- Documentation. Condition "A.Type == 'via' .