Labels Milestones
BackMounted DIP package, row spacing 22.86 mm (900 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 10.16.
- Package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf muRata MEJ1SxxxxSC, 19.5x9.8x12.5mm.
- 9-pin D-Sub connector horizontal angled 90deg THT.