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Kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic Micro Small Outline (SS)-5.30 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=212), generated with kicad-footprint-generator connector Hirose DF13 through hole, DF11-20DP-2DSA, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1825 (4564 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.vishay.com/docs/20056/crcw01005e3.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0610, with PCB locator, 4 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-60DS-0.5V, 60 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package LFCSP (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; No exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin Placed - Wide, 7.50 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 12x12x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator connector wire 0.75sqmm double-strain-relief Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch.

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