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THT 1x03 1.27mm single row male, vertical entry Harwin LTek Connector, 7 pins, single row Through hole angled socket strip SMD 2x29 2.00mm double row surface-mounted straight pin header, 1x40, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 2x20 2.54mm double row surface-mounted straight pin header, 2x22, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x14 1.00mm double row surface-mounted straight socket strip, 2x18, 1.00mm pitch, double rows Through hole socket strip SMD 1x16 1.00mm single row Through hole angled socket strip, 2x13, 2.54mm pitch, double rows Surface mounted socket strip THT 1x26 1.00mm single row style1 pin1 left Surface mounted socket strip THT 2x05 2.54mm double row Through hole angled socket strip, 2x05, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x10, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x37 2.54mm single row Through hole angled pin header THT 1x34 2.00mm single row Through hole angled socket strip SMD 2x34 2.54mm double row surface-mounted straight socket strip, 2x38, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x07 2.54mm double row Molex LY 20 series connector, B07B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=283), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1210, with PCB locator, 4 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM03B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm.

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