Labels Milestones
BackSmallPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole.
- Capacitor, http://cdn-reichelt.de/documents/datenblatt/B300/DS_KERKO_TC.pdf C Disc.
- Branch pcb_finalization re-re-remove the mysterious extra trace.
- Caixa_sr1.png Image of caxia score Samurai Latest commits.
- Pushbutton momentary, but roughly same.
- Add very little cost.