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Copal_CVS-01xB, Slide, row spacing 22.86 mm (900 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Quad Flat, No Lead Package, 1.2x1.8x1.55 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST PUD series connector, B15B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://www.ti.com/lit/ds/symlink/cc430f5137.pdf#page=128), generated with kicad-footprint-generator JST VH series connector, B4PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xxx-DV-LC, 41 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 11.6, Wuerth electronics 9774100360 (https://katalog.we-online.de/em/datasheet/9774100360.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90325-0024, 24 Pins per row (https://www.molex.com/pdm_docs/sd/022057045_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.15 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.127 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator connector JST ZE series connector, B10B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic DFN (6mm x 5mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic.

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