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Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package.

• 6.73225 -0.892525 7.87036 facet normal -0.33413 0.625115 0.7054.
• Vertex -0.0519739 7.10795 6.88717 facet.
• -4.648473e-001 -8.134815e-001 3.495210e-001 facet normal -6.467842e-01.
• THT 1x19 2.00mm single row Surface.

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