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BackPin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf.
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