Labels Milestones
BackDSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YZR pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.605x2.703mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7.
- Body, https://www.diodes.com/assets/Package-Files/PowerDI3333-8%20(Type%20UXC).pdf Infineon, PG-TDSON-8.
- Width 20mm Capacitor C, Rect series, Radial, pin.
- 932AZ (see ON Semiconductor 932BB.PDF 144-Lead Plastic.