3
1
Back

-5.29418 -5.16563 6.86711 facet normal -0.0623605 0.633165 0.771501 vertex -8.56166 0 5.56266 vertex 8.39715 1.6703 5.56266 facet normal 9.512738e-01 1.552756e-03 3.083435e-01 vertex -1.052128e+02 9.695134e+01 1.101727e+01 facet normal -0.0922671 -0.172963 0.980597 vertex -5.35022 5.0946 6.88312 facet normal -0.796853 -0.241727 0.553709 facet normal -9.712941e-01 -2.378820e-01 1.430808e-04 facet normal -0.796857 0.241727 0.553703 facet normal 0.976223 -0.0962896 0.194209 vertex 10.1904 0 0 Y N 1 F N DEF power_GND #PWR 0 0 Y N 1 F N DEF SW_Push_Open SW 0 20 Y N 1 F P Hardware/Panel/precadsr-panel/precadsr-panel-rescue.kicad_sym Normal file Unescape Hardware/Panel/precadsr_panel_al/sym-lib-table Normal file Unescape // Width of module (HP) width = 12; // [1:1:84] // margins from edges h_margin = thickness*2; v_margin = hole_dist_top*5; output_column = width_mm - h_margin; cv_in = [first_col, fifth_row, 0]; pwm_duty = [input_column, bottom_row, 0]; pwm_duty = [input_column, bottom_row, 0]; pwm_pot = [input_column + h_margin/2, row_1, 0]; audio_out_2 = [right_col, row_2, 0]; cv_2b_atten = [right_col, row_6, 0]; audio_in_1 = [left_col, row_2, 0]; fm_in = [first_col, fifth_row, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_4, 0]; left_rib_x = thickness of 2mm - but adjust to shift left and right columns toward the center center_adjust = 2.5; rail_clearance = 8; // mm from very top/bottom edge and where it is based on https://www.analog.com/media/en/technical-documentation/data-sheets/199399fc.pdf TO-92 2-pin variant by Heraeus, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=80), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_8_6.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin 2x2mm Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm vertical Molex KK-254 Interconnect System, old/engineering part number: 26-60-4040, 4 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-6410, 64 Pins (http://www.molex.com/pdm_docs/sd/5024260810_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00479-02.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP 8pin 2x2mm.

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