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WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x16, 2.00mm pitch, double rows Through hole angled socket strip SMD 1x35 2.54mm single row Through hole pin header THT 1x20 2.54mm single row Through hole angled pin header THT 1x17 2.00mm single row Surface mounted socket strip THT 1x05 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x37 2.00mm double row Through hole IDC header, 2x13, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole pin header SMD 1x13 2.00mm single row.

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