Labels Milestones
BackWLCSP-156, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 324 0.8 CS324 CSG324.
- 0.555503 -0.831514 -4.52541e-05 vertex -2.40512.
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X="3.8" y="1.3"/>
Dual output DCDC-Converter, CINCON. - Row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator JST XA.