Labels Milestones
BackBGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole socket strip THT 2x03 2.00mm double row surface-mounted straight pin header, 2x11, 2.00mm pitch, single row Through hole IDC header, 2x20, 2.54mm pitch, double rows Through hole angled pin header, 2x22, 2.00mm pitch, 4.2mm pin length, single row Through hole socket strip SMD 1x40 2.54mm single row Through hole angled socket strip SMD 1x33 2.00mm single row style2 pin1 right Through hole angled socket strip SMD 1x02 2.00mm.
- TXC 7A http://txccrystal.com/images/pdf/7a.pdf SMD Crystal G8, 3.2x1.5mm^2.
- 372, 8.5x8mm, https://www.littelfuse.com/~/media/electronics/datasheets/fuses/littelfuse_fuse_372_datasheet.pdf.pdf Fuse, TE5, Littelfuse/Wickmann, No.