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13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ diameter 1.0mm, hole diameter 0.5mm test point plated hole Plated Hole as test point, loop diameter2.6mm, hole diameter 1.0mm low profile wire loop as test point, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R5xxxPA, SIP-12, pitch 2.54mm, size 13.2x6.2mm^2, drill diamater 1.2mm, pad diameter 2mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, DF11-22DP-2DSA, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Fuse SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B8B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated.

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