Labels Milestones
BackSocket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x21.88mm 8x-dip-switch SPST.
- 100k | Resistor | | | | .
- LVL R5 PWM CV.
- 50.8x11.2mm^2 drill 1.3mm pad.
- Thickness to account for squishing.