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3D Printing/Panels/image.png | Bin 0 -> 30552 bytes From 2bb058d5715f395d3571ea05d3008566787a2bdb Mon.

• Pitch, Intel 386EX (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP.
• Shielded I/O Plug, Type C, vertical.
• Fiberoptic Reciver, RX, Toshiba, Toslink, TORX170, TORX173.
• Size 15x11mm^2, drill diamater 1.2mm, pad diameter.

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