Labels Milestones
Back0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 16-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 28 leads; body width 5.3 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads in-line, wide, drill 0.75mm (see NXP sot054_po.pdf TO-92 horizontal, leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink.
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