Labels Milestones
BackPlastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [QFN]; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h747xi.pdf DFN, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/(DCB6)%20DFN%2005-08-1715%20Rev%20A.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0410-4-51, 10 Pins per row.
- -0.471388 -0.881926 6.69388e-06 facet.
- MKDS-1,5-8-5.08, 8 pins, pitch 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf.
- 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile.
- 0.900349 0.423684 0.0993114 facet normal.