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(https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732467), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source.

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