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0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (http://www.allegromicro.com/~/media/Files/Datasheets/A4950-Datasheet.ashx#page=8), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0012 example for new part number: AE-6410-13A example for new mpn: 39-28-914x, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 2.6.

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