3
1
Back

DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x20, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x11 1.27mm double row Through hole angled socket strip SMD 1x40 2.54mm single row Surface mounted pin header THT 1x04 5.08mm single row Through hole pin.

New Pull Request