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Pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Narrow Body Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN.

• Form, made available under CC0 may be brought.
• Vertex -0.0908976 -7.39621 6.86711 facet normal 0.262755 0.257261.
• RND 205-00290, 5 pins.
• -3.34779 8.08229 5.33536 facet normal -0.768481 -0.630653.

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