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3M 14-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST CTS_Series194-6MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SA MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET ME MOSFET Infineon PLCC, 20 pins, dual row male, vertical entry, PN:G125-FVX2005L0X Harwin Gecko Connector, 26 pins, dual row male, vertical entry Harwin LTek Connector, 4 pins, pitch 2.54mm, package size 69.98x30x15.64mm, https://silvertel.com/images/datasheets/Ag5810-datasheet-IEEE802_3bt-Power-over-Ethernet-4-pair-PD.pdf DCDC-Converter Silvertel Ag5810 single output Power Module uPOL MUN12AD03 Meanwell DCDC non-isolated converter SIP module, http://www.meanwell.com/webapp/product/search.aspx?prod=nid30 Isolated 1W or 2W Single and Dual Output, 1500VDC Isolation, 19.0x17.0x8.7mm https://www.xppower.com/Portals/0/pdfs/SF_ISU02.pdf DCDC SMD XP POWER ISU02 XP_POWER ITQxxxxS-H, SIP, (https://www.xppower.com/pdfs/SF_ITQ.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm X2SON-8 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6 D6+1,https://datasheets.maximintegrated.com/en/ds/DS2401.pdf, https://pdfserv.maximintegrated.com/land_patterns/90-0321.PDF ATPAK SMD package, http://www.infineon.com/cms/en/product/packages/PG-TO252/PG-TO252-5-11/ TO-263/D2PAK/DDPAK SMD package, http://www.icbank.com/icbank_data/semi_package/to268aa_dim.pdf D3PAK TO-268 D3PAK-3 TO-268-3 SMD package TO-269AA (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge Diotec SO-DIL Slim, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/b40fs.pdf SMD diode bridge Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN] (see Microchip.

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