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WLCSP-100, off-center ball grid, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm.

• 2.5504 -5.20733 21.335 facet normal 0.900548.
• 2.588131e-001 vertex 7.322609e-001 5.341558e+000 2.470218e+001 facet normal.
• See http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch.
• -4.589969e-01 8.884379e-01 -1.036970e-04 facet normal 0.111553.
• -4.517184e+000 1.747200e+001 facet normal -0.114155.

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